In FFlexCom, we expect to cover the following research areas:
- Research on optimized wireless system architectures taking into account the limited operation frequencies, bandwidths and device counts of TOLAE technologies. Activities demonstrating the data communication on basis of receivers and/or transmitters fully integrated in TOLAE technologies are highly encouraged. The investigations can also include multifunctional flexible wireless systems featuring localisation radar and identification in addition to communications.
- Design of key circuits such as low noise amplifiers, power amplifiers, low noise oscillators and synthesisers, frequency converters, analogue to digital converters and digital to analogue converters, as well as simple data modulators and demodulators using fast TOLAE technologies. One main challenge is to achieve sufficiently high operation frequencies considering the moderate performance of TOLAE devices.
- Exploration of concepts for TOLAE devices such as transistors and diodes which enable very high operation frequencies up to the GHz regime. Examples for corresponding innovations are: Vertical transistor structures, aggressively down-scaled gate lengths, 2-D semiconductors or even 1-D structures. Advanced organic and inorganic high-mobility materials such as indium gallium zinc oxide, zinc tin oxide, molybdenum sulphide, tungsten disulphide, are examples for promising candidates for high speed TOLAE transistors. Low loss passive TOLAE devices (if possible tuneable) such as inductors, capacitors, antennas, filters and resonators are also important components.
- Precise compact small signal, large signal and noise modelling for the TOLAE devices enabling efficient circuit design.
- Advanced studies for low loss homogeneous and heterogeneous packaging of TOLAE devices and TOLAE based interconnects maintaining flexibility.
The fabrication methods of the devices, circuits and systems can e.g. be based on printing, nano-imprint, lithography, spray-coating, transfer printing and hybrid approaches. Implementations on flexible plastic or paper substrates, as well as on flexible ultra-thinned chips (e.g. on silicon), are considered.
The research should have suited application scenarios in mind. Examples for applications are data communications for sensor and actuator networks, medical and on-body use, fully flexible broadcast radios, smart item tracking, and textile integration.
Further ideas aiming at advancing the speed of TOLAE-devices, -circuits and -systems for wireless communications and visions for corresponding applications are welcome.